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I. Basic Information for CVE-2017-18297
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm SD 425等都是美国高通(Qualcomm)公司的一款中央处理器(CPU)产品。 多款Qualcomm Snapdragon产品中的Trusted Application Environment存在资源管理错误漏洞。攻击者可利用该漏洞造成应用程序崩溃。以下产品及版本受到影响:Qualcomm SD 425;SD 430;SD 450;SD 625;SD 650/52;SD 820。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820 -
II. Public POCs for CVE-2017-18297
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III. Intelligence Information for CVE-2017-18297
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IV. Related Vulnerabilities
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