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I. Basic Information for CVE-2017-18309
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm SD 845和SD 850 G-Link 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm SD 845和SD 850都是美国高通（Qualcomm）公司的中央处理器（CPU）产品。G-Link是其中的一个汽车-手机交互系统。 Qualcomm SD 845和SD 850（用于汽车）中的G-Link存在安全漏洞，该漏洞源于程序没有正确的验证数组索引。本地攻击者可利用该漏洞读取或写入任意内存。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile SD 845, SD 850 -
II. Public POCs for CVE-2017-18309
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III. Intelligence Information for CVE-2017-18309
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New Vulnerabilities
Product: Snapdragon Mobile
Vendor: Qualcomm, Inc.
V. Comments for CVE-2017-18309

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