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I. Basic Information for CVE-2019-10624
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
While handling the vendor command there is an integer truncation issue that could yield a buffer overflow due to int data type copied to u8 data type in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile in APQ8096AU, MSM8996AU, QCA6574AU, QCN7605, Rennell, SC8180X, SDM710, SDX55, SM7150, SM8150, SM8250, SXR2130
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MSM8996AU等都是美国高通（Qualcomm）公司的产品。MSM8996AU是一款中央处理器（CPU）产品。QCA6574AU是一款中央处理器（CPU）产品。SDX55是一款调制解调器。 多款Qualcomm产品中的WLAN HOST存在输入验证错误漏洞。攻击者可借助特制的文件利用该漏洞在系统上执行任意代码。以下产品及版本受到影响：Qualcomm APQ8096AU；MSM8996AU；QCA6574AU；QCN7605；Rennell；SC8180X；SDM710；SDX55；
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile APQ8096AU, MSM8996AU, QCA6574AU, QCN7605, Rennell, SC8180X, SDM710, SDX55, SM7150, SM8150, SM8250, SXR2130 -
II. Public POCs for CVE-2019-10624
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III. Intelligence Information for CVE-2019-10624
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New Vulnerabilities
Vendor: Qualcomm, Inc.
V. Comments for CVE-2019-10624

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