Vulnerability Information
Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.
Vulnerability Title
N/A
Vulnerability Description
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.
CVSS Information
N/A
Vulnerability Type
N/A
Vulnerability Title
多款Telink Semiconductor产品 缓冲区错误漏洞
Vulnerability Description
Telink Semiconductor BLE SDK是中国泰凌微（Telink Semiconductor）公司的一款应用程序。 多款Telink Semiconductor产品存在缓冲区错误漏洞。攻击者可借助特制的数据包利用该漏洞造成拒绝服务。以下产品及版本受到影响：Telink Semiconductor TLSR8258 BLE SDK 3.4.0及之前版本；Telink Semiconductor TLSR8269 BLE SDK 3.3及之前版本；Telink Semiconductor T
CVSS Information
N/A
Vulnerability Type
N/A