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I. Basic Information for CVE-2021-35113
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible authentication bypass due to improper order of signature verification and hashing in the signature verification call in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:N
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片数据伪造问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在数据伪造问题漏洞，该漏洞源于应用签名验证调用中的签名验证和散列顺序不正确。具有物理访问权限的攻击者可以绕过系统上的身份验证利用该漏洞破坏目标系统。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables AQT1000, CSRB31024, QCA6174A, QCA6310, QCA6335, QCA6420, QCA6430, QCA6564AU, QCA6574AU, QCA6595AU, QCA6696, QCA9377, QCS410, QCS610, SA415M, SD 675, SD429, SD675, SD678, SD720G, SD730, SD7c, SD845, SD850, SD855, SDM429W, SDX24, SDX50M, SDX55, SDX55M, SM62 -
II. Public POCs for CVE-2021-35113
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III. Intelligence Information for CVE-2021-35113
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-35113

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