Vulnerability Information
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Vulnerability Title
Stack overflow on SK_LOAD signature length field in Texas Instruments OMAP L138
Vulnerability Description
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H
Vulnerability Type
栈缓冲区溢出
Vulnerability Title
Texas Instruments OMAP L138 缓冲区错误漏洞
Vulnerability Description
Texas Instruments OMAP L138是美国德州仪器（Texas Instruments）公司的一个DSP+ARM工业处理器。 Texas Instruments OMAP L138 (secure variants)存在安全漏洞，该漏洞源于(TEE) 缺少对掩码 ROM 中存在的 SK_LOAD 模块加载例程中的签名大小字段的边界检查，足够大签名字段的模块会导致堆栈溢出，从而影响安全内核数据页，攻击者利用该漏洞可以在安全管理程序上下文中任意代码执行。
CVSS Information
N/A
Vulnerability Type
N/A