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I. Basic Information for CVE-2022-33248
Vulnerability Information

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Vulnerability Title
Integer overflow to buffer overflow in User Identity Module
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
整数溢出导致缓冲区溢出
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片 User Identity 模块存在安全漏洞,该漏洞源于当通过 qmi http 接收分段时,由于整数溢出到缓冲区溢出,用户身份模块中的内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon APQ8009 -
II. Public POCs for CVE-2022-33248
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III. Intelligence Information for CVE-2022-33248
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