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I. Basic Information for CVE-2022-33265
Vulnerability Information
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Vulnerability Title
Information exposure in Powerline Communication Firmware
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption due to information exposure in Powerline Communication Firmware while sending different MMEs from a single, unassociated device.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于信息泄露而导致内存损坏。以下产品受到影响：QCA7500, QCA7520, QCA7550。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon QCA7500 -
II. Public POCs for CVE-2022-33265
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III. Intelligence Information for CVE-2022-33265
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-33265

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