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I. Basic Information for CVE-2023-33029
Vulnerability Information
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Vulnerability Title
Use After Free in DSP Service
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in DSP Service during a remote call from HLOS to DSP.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
释放后使用
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在资源管理错误漏洞，该漏洞源于从 HLOS 到 DSP 的远程调用期间 DSP 服务中的内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon AR8035 -
II. Public POCs for CVE-2023-33029
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III. Intelligence Information for CVE-2023-33029
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-416
V. Comments for CVE-2023-33029

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