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I. Basic Information for CVE-2023-33037
Vulnerability Information
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Vulnerability Title
Cryptographic Issues in Automotive
Source: NVD (National Vulnerability Database)
Vulnerability Description
Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N
Source: NVD (National Vulnerability Database)
Vulnerability Type
加密问题
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于解包密钥 secs2d 并使用 RPMB 数据进行验证时，汽车中存在加密问题。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon AR8035 -
II. Public POCs for CVE-2023-33037
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III. Intelligence Information for CVE-2023-33037
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-310
V. Comments for CVE-2023-33037

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