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I. Basic Information for CVE-2024-23374
Vulnerability Information
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Vulnerability Title
Stack-based Buffer Overflow in Power Management IC
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
栈缓冲区溢出
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于 Power Management IC 中包含一个堆栈缓冲区溢出。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon FastConnect 6900 -
II. Public POCs for CVE-2024-23374
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III. Intelligence Information for CVE-2024-23374
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-121
V. Comments for CVE-2024-23374

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