以下是从该网站截图中获取到的关于漏洞的关键信息，以简洁的Markdown格式呈现： --- February 2026 Security Bulletin Proprietary Software Issues --- Open Source Software Issues --- Summary CVE-2025-47363: Integer Overflow or Wraparound in Automotive Security. CVE-2025-47364: Integer Overflow or Wraparound in Automotive Security. CVE-2025-47366: Exposed Dangerous Method or Function in HLOS. CVE-2025-47399: Buffer Copy Without Checking Size of Input in Camera. CVE-2025-47402: Buffer Over-read in WLAN Firmware. CVE-2025-47358: Use After Free in Secure Processor. CVE-2025-47359: Use After Free in Secure Processor. CVE-2025-47397: Improper Release of Memory Before Removing Last Reference in Graphics. CVE-2025-47398: Use After Free in Graphics. OEMs Notification: Patches for these vulnerabilities are being actively shared with OEMs, who are recommended to deploy patches on released devices as soon as possible. Affecting Chipsets: The bulletin lists specific Qualcomm chipsets affected by each vulnerability. For instance, CVE-2025-47363 affects Snapdragon and FastConnect chipsets. Date Reported: Internal reporting for most vulnerabilities, indicating internal discovery. CVSS Scores: Varying CVSS scores indicating the severity of each vulnerability. Some have high severity ratings, requiring immediate attention. --- This summary provides a concise overview of the key vulnerabilities listed in the February 2026 Security Bulletin from Qualcomm.