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I. Basic Information for CVE-2018-11824
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
A stack-based buffer overflow can occur in a firmware routine in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, SDA660
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中的固件程序存在基于栈的缓冲区溢出漏洞。攻击者可利用该漏洞执行任意代码或造成拒绝服务。以下产品（用于移动和可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；MDM9650；SD 210；SD 212；SD 205；SD 835；SD 845；SD 850；SDA660。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, SDA660 -
II. Public POCs for CVE-2018-11824
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III. Intelligence Information for CVE-2018-11824
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New Vulnerabilities
Product: Snapdragon Mobile, Snapdragon Wear
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11824

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