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I. Basic Information for CVE-2018-5879
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper length check while processing an MQTT message can lead to heap overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm snapdragon产品中存在缓冲区错误漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（用于移动和可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；SD 210；SD 212；SD 205；SD 425；SD 427；SD 430；SD 435；SD 450；SD 625；SD 636；SD 835；SDA660；SDM63
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660 -
II. Public POCs for CVE-2018-5879
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III. Intelligence Information for CVE-2018-5879
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IV. Related Vulnerabilities
Same product: Snapdragon Mobile, Snapdragon Wear
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2018-5879

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