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I. Basic Information for CVE-2018-11993
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper check while accessing the local memory stack on MQTT connection request can lead to buffer overflow in snapdragon wear in versions MDM9206, MDM9607
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm MDM9206和MDM9607产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206和MDM9607都是美国高通（Qualcomm）公司的中央处理器（CPU）产品。 Qualcomm MDM9206和MDM9607产品中存在越界写入漏洞，该漏洞源于程序执行了错误的边界检查。攻击者可利用该漏洞在系统上执行任意代码或造成拒绝服务。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Wear MDM9206, MDM9607 -
II. Public POCs for CVE-2018-11993
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III. Intelligence Information for CVE-2018-11993
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New Vulnerabilities
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11993

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