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I. Basic Information for CVE-2018-11857
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper input validation in WLAN encrypt/decrypt module can lead to a buffer copy in Snapdragon Mobile in version SD 835, SD 845, SD 850
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm SD 835、SD 845和SD 850 WLAN encrypt/decrypt模块缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm SD 835、SD 845和SD 850都是美国高通（Qualcomm）公司的中央处理器（CPU）产品。WLAN encrypt/decrypt是其中的一个无线局域网加密/解密模块。 Qualcomm SD 835、SD 845和SD 850（用于移动设备）中的WLAN encrypt/decrypt模块存在缓冲区溢出漏洞，该漏洞源于程序没有进行正确的输入验证。本地攻击者可利用该漏洞执行任意代码或造成拒绝服务。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile SD 835, SD 845, SD 850 -
II. Public POCs for CVE-2018-11857
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III. Intelligence Information for CVE-2018-11857
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IV. Related Vulnerabilities
Same product: Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11857

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