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I. Basic Information for CVE-2018-11947
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
The txrx stats req might be double freed in the pdev detach when the host driver is unloading in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8064, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCA9558, QCA9880, QCA9886, QCA9980, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品WLAN 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的产品。MDM9206是一款中央处理器（CPU）产品。MDM9607是一款中央处理器（CPU）产品。MDM9640是一款中央处理器（CPU）产品。WLAN是其中的一个无线局域网组件。 多款Qualcomm产品中的WLAN存在资源管理错误漏洞。该漏洞源于网络系统或产品对系统资源（如内存、磁盘空间、文件等）的管理不当。以下产品及版本受到影响：Qualcomm IPQ8064；MDM9150；MDM9206；MDM9607；MDM9640；M
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking IPQ8064, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCA9558, QCA9880, QCA9886, QCA9980, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 675, SD 712 / SD 7 -
II. Public POCs for CVE-2018-11947
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III. Intelligence Information for CVE-2018-11947
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New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11947

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