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CVE-2018-13927

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在授权问题漏洞。该漏洞源于网络系统或产品中缺少身份验证措施或身份验证强度不足。以下产品及版本受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MDM9655；MSM8996AU；QCS404；QCS605；SD 410/12；SD 636；SD 712；SD 710；SD 670；SD 820；SD 820A；SD 835；SD 845；SD 850

AI Predicted 6.7 Difficulty: Moderate EPSS 0.18% · P7
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I. Basic Information for CVE-2018-13927

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Debug policy with invalid signature can be loaded when the debug policy functionality is disabled by using the parallel image loading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SXR1130
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品授权问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在授权问题漏洞。该漏洞源于网络系统或产品中缺少身份验证措施或身份验证强度不足。以下产品及版本受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MDM9655；MSM8996AU；QCS404；QCS605；SD 410/12；SD 636；SD 712；SD 710；SD 670；SD 820；SD 820A；SD 835；SD 845；SD 850
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SXR1130 -

II. Public POCs for CVE-2018-13927

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III. Intelligence Information for CVE-2018-13927

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Other References for CVE-2018-13927 (1)

Same Patch Batch · Qualcomm, Inc. · 2019-07-22 · 12 CVEs total

CVE-2018-13896 多款Qualcomm产品访问控制错误漏洞
CVE-2018-13924 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2243 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2260 多款Qualcomm产品资源管理错误漏洞
CVE-2019-2261 多款Qualcomm产品配置错误漏洞
CVE-2019-2264 多款Qualcomm产品代码问题漏洞
CVE-2019-2269 多款Qualcomm产品WLAN 缓冲区错误漏洞
CVE-2019-2277 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2279 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2287 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2292 多款Qualcomm产品缓冲区错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2018-13927

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