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I. Basic Information for CVE-2019-10502
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible stack overflow when an index equal to io buffer size is accessed in camera module in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 845 / SD 850, SD 855, SDM439, SDX24
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm SD 210等都是美国高通(Qualcomm)公司的产品。SD 210是一款中央处理器(CPU)产品。SD 212是一款中央处理器(CPU)产品。SD 205是一款中央处理器(CPU)产品。 多款Qualcomm产品中的Automotive Multimedia存在缓冲区错误漏洞。该漏洞源于网络系统或产品在内存上执行操作时,未正确验证数据边界,导致向关联的其他内存位置上执行了错误的读写操作。攻击者可利用该漏洞导致缓冲区溢出或堆溢出等。以下产品及版本受到影响:Qualcomm MSM890
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables MSM8909W, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 845 / SD 850, SD 855, SDM439, SDX24 -
II. Public POCs for CVE-2019-10502
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III. Intelligence Information for CVE-2019-10502
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IV. Related Vulnerabilities
V. Comments for CVE-2019-10502

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