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I. Basic Information for CVE-2019-10605
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Buffer overwrite can occur in IEEE80211 header filling function due to lack of range check of array index received from firmware in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, IPQ8074, MDM9607, MDM9650, MSM8909, MSM8939, QCN7605, SDA660, SDM630, SDM636, SDM660, SDX20, SDX24
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9607等都是美国高通（Qualcomm）公司的产品。MDM9607是一款中央处理器（CPU）产品。MDM9650是一款中央处理器（CPU）产品。SDX24是一款调制解调器。 多款Qualcomm产品中的WLAN Host存在缓冲区错误漏洞，该漏洞源于程序没有充分检查接收到的数组索引的范围。本地攻击者可利用该漏洞在系统上执行任意代码。以下产品及版本受到影响：Qualcomm APQ8009；APQ8053；IPQ8074；MDM9607；MDM9650；MSM8909；MSM893
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking APQ8009, APQ8053, IPQ8074, MDM9607, MDM9650, MSM8909, MSM8939, QCN7605, SDA660, SDM630, SDM636, SDM660, SDX20, SDX24 -
II. Public POCs for CVE-2019-10605
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III. Intelligence Information for CVE-2019-10605
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IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2019-10605

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