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I. Basic Information for CVE-2019-14075
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Null pointer dereference issue in radio interface layer due to lack of null check in sapmodule destructor in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9607, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8998, Nicobar, QCS605, Rennell, Saipan, SDM450, SDM630, SDM636, SDM660, SDM670, SDM710, SM6150, SM7150, SM8150, SM8250, SXR2130
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9607等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中的Radio Interface layer存在代码问题漏洞。该漏洞源于网络系统或产品的代码开发过程中存在设计或实现不当的问题。以下产品及版本受到影响：Qualcomm MDM9607；MSM8917；MSM8920；MSM8937；MSM8940；MSM8953；MSM8998；Nicobar；QCS605；Rennell；Saipan；SDM450；SDM630；SDM63
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile MDM9607, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8998, Nicobar, QCS605, Rennell, Saipan, SDM450, SDM630, SDM636, SDM660, SDM670, SDM710, SM6150, SM7150, SM8150, SM8250, SXR2130 -
II. Public POCs for CVE-2019-14075
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III. Intelligence Information for CVE-2019-14075
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New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Vendor: Qualcomm, Inc.
V. Comments for CVE-2019-14075

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