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I. Basic Information for CVE-2020-11117
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
u'In the lbd service, an external user can issue a specially crafted debug command to overwrite arbitrary files with arbitrary content resulting in remote code execution.' in Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ6018, IPQ8064, IPQ8074, QCA4531, QCA9531, QCA9980
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm多款产品命令注入漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm多款产品存在命令注入漏洞。攻击者可借助特制的调试命令利用该漏洞使用任意内容覆盖任意文件并执行代码。以下产品及版本受到影响：Qualcomm IPQ4019；IPQ6018；IPQ8064；IPQ8074；QCA4531；QCA9531；QCA9980。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Wired Infrastructure and Networking IPQ4019, IPQ6018, IPQ8064, IPQ8074, QCA4531, QCA9531, QCA9980 -
II. Public POCs for CVE-2020-11117
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III. Intelligence Information for CVE-2020-11117
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New Vulnerabilities
Vendor: Qualcomm, Inc.
V. Comments for CVE-2020-11117

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