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I. Basic Information for CVE-2020-11273
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Histogram type KPI was teardown with the assumption of the existence of histogram binning info and will lead to null pointer access when histogram binning info is missing due to lack of null check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Snapdragon SOC 代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Snapdragon SOC（骁龙处理器）是美国高通（Qualcomm）公司的一款应用于移动设备处理信息的芯片。 Qualcomm Snapdragon SOC存在安全漏洞，该漏洞源于缺乏零核对，导致空指针访问当直方图装箱信息丢失。以下产品及版本受到影响:CSRB31024, PM3003A, PM6150A, PM6150L, PM6350, PM7150A, PM7150L, PM7250, PM7250B, PM8005, PM8008, PM8009, PM8150A, PM81
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile CSRB31024, PM3003A, PM6150A, PM6150L, PM6350, PM7150A, PM7150L, PM7250, PM7250B, PM8005, PM8008, PM8009, PM8150A, PM8150B, PM8150C, PM8150L, PM8250, PM8350, PM8350B, PM8350BH, PM8350C, PM855, PM855B, PM855L, PM8998, PMI8998, PMK8002, PMK8003, PMK8350, PMR -
II. Public POCs for CVE-2020-11273
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III. Intelligence Information for CVE-2020-11273
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2020-11273

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