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I. Basic Information for CVE-2020-11291
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible buffer overflow while updating ikev2 parameters for delete payloads received during informational exchange due to lack of check of input validation for certain parameters received from the ePDG server in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 产品存在输入验证错误漏洞,该漏洞由于缺乏对从 ePDG 服务器接收的某些参数的输入验证检查,更新 ikev2 参数以删除在信息交换期间收到的有效负载时可能出现缓冲区溢出。以下产品和版本受影响:APQ8017、APQ8053、AQT1000、CSRB31024、MSM8917、MSM8920、MSM8940、MSM8953、MSM8
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile APQ8017, APQ8053, AQT1000, CSRB31024, MSM8917, MSM8920, MSM8940, MSM8953, MSM8976, MSM8976SG, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6595AU, QCA6696, QCA9377, QCA9379 -
II. Public POCs for CVE-2020-11291
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III. Intelligence Information for CVE-2020-11291
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