CVE-2020-11291
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 产品存在输入验证错误漏洞，该漏洞由于缺乏对从 ePDG 服务器接收的某些参数的输入验证检查，更新 ikev2 参数以删除在信息交换期间收到的有效负载时可能出现缓冲区溢出。以下产品和版本受影响:APQ8017、APQ8053、AQT1000、CSRB31024、MSM8917、MSM8920、MSM8940、MSM8953、MSM8
Possible ATT&CK Techniques 1 AI
T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2020-11291
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible buffer overflow while updating ikev2 parameters for delete payloads received during informational exchange due to lack of check of input validation for certain parameters received from the ePDG server in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 产品存在输入验证错误漏洞，该漏洞由于缺乏对从 ePDG 服务器接收的某些参数的输入验证检查，更新 ikev2 参数以删除在信息交换期间收到的有效负载时可能出现缓冲区溢出。以下产品和版本受影响:APQ8017、APQ8053、AQT1000、CSRB31024、MSM8917、MSM8920、MSM8940、MSM8953、MSM8
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | APQ8017, APQ8053, AQT1000, CSRB31024, MSM8917, MSM8920, MSM8940, MSM8953, MSM8976, MSM8976SG, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6595AU, QCA6696, QCA9377, QCA9379 | - |
|
II. Public POCs for CVE-2020-11291
| # | POC Description | Source Link | Shenlong Link |
|---|
AI-Generated POC
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Other References for CVE-2020-11291 (1)
-
https://www.qualcomm.com/company/product-security/bulletins/june-2021-bulletin x_refsource_CONFIRM
Same Patch Batch · Qualcomm, Inc. · 2021-06-09 · 33 CVEs total
| CVE-2020-11176 | 9.8 CRITICAL | Qualcomm 组件缓冲区错误漏洞 |
| CVE-2021-1900 | 8.4 HIGH | Google Android资源管理错误漏洞 |
| CVE-2020-11267 | 8.4 HIGH | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2020-11306 | 7.8 HIGH | Google Android输入验证错误漏洞 |
| CVE-2020-11304 | 7.8 HIGH | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2020-11298 | 7.8 HIGH | Google Android安全漏洞 |
| CVE-2020-11292 | 7.8 HIGH | 多款Qualcomm产品安全漏洞 |
| CVE-2021-1937 | 7.5 HIGH | Google Android安全漏洞 |
| CVE-2020-11257 | Qualcomm WIN TZ FW 缓冲区错误漏洞 | |
| CVE-2020-11266 | Qualcomm WIN TZ FW 安全漏洞 | |
| CVE-2020-11265 | Qualcomm WIN TZ FW 缓冲区错误漏洞 | |
| CVE-2020-11262 | 高通 Qualcomm Graphics 资源管理错误漏洞 | |
| CVE-2020-11261 | 高通 Qualcomm Graphics 输入验证错误漏洞 | |
| CVE-2020-11260 | 高通 Qualcomm Core 安全漏洞 | |
| CVE-2020-11259 | Qualcomm WIN TZ FW 缓冲区错误漏洞 | |
| CVE-2020-11258 | Qualcomm WIN TZ FW 缓冲区错误漏洞 | |
| CVE-2020-11126 | Qualcomm Wlan Firmware 缓冲区错误漏洞 | |
| CVE-2020-11256 | 高通 Qualcomm WIN TZ FW 缓冲区错误漏洞 | |
| CVE-2020-11250 | 高通 Qualcomm Dsp Service 资源管理错误漏洞 | |
| CVE-2020-11241 | 高通 Qualcomm Wlan Firmware 缓冲区错误漏洞 |
Showing top 20 of 33 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
V. Comments for CVE-2020-11291
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