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I. Basic Information for CVE-2020-3691
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible out of bound memory access in audio due to integer underflow while processing modified contents in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 多款Qualcomm产品存在数字错误漏洞,该漏洞源于在处理修改后的内容时,由于整数下溢,可能导致音频中的内存超出范围。以下产品和版本受到影响:Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Indust
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking APQ8009, APQ8009W, APQ8017, APQ8030, APQ8037, APQ8052, APQ8053, APQ8056, APQ8060A, APQ8062, APQ8064, APQ8064AU, APQ8076, APQ8084, APQ8096AU, AQT1000, AR6003, AR8031, AR8035, AR8151, AR9374, CSRA6620, CSRA6640, CSRB31024, MDM8215, MDM8215M, MDM8615M, MDM86 -
II. Public POCs for CVE-2020-3691
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III. Intelligence Information for CVE-2020-3691
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IV. Related Vulnerabilities
V. Comments for CVE-2020-3691

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