Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在资源管理错误漏洞,该漏洞源于在处理 ION 句柄时内核释放问题导致内存损坏,以下产品和版本受到影响:APQ8009, APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, CSRB31024, MDM9150, MDM9206, MDM9250, MDM9607, MDM9626,
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| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | APQ8009, APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, CSRB31024, MDM9150, MDM9206, MDM9250, MDM9607, MDM9626, MDM9628, MDM9640, MDM9650, MSM8909W, MSM8917, MSM8937, MSM8953, MSM8996AU, PM8937, QCA4020, QCA6174A, QCA6175A, QCA6310, QCA6320, QCA6335, QCA | - |
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| # | POC Description | Source Link | Shenlong Link |
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