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CVE-2022-22060— Reachable Assertion in Modem

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于验证不当，在处理重新配置消息时发生断言。

CVSS 7.5 · High EPSS 0.38% · P30

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2022-22060

Vulnerability Information
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Vulnerability Title
Reachable Assertion in Modem
Source: CVE Program / CVE List V5
Vulnerability Description
Assertion occurs while processing Reconfiguration message due to improper validation
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
可达断言
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于验证不当，在处理重新配置消息时发生断言。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon 315 5G IoT Modem -

II. Public POCs for CVE-2022-22060

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III. Intelligence Information for CVE-2022-22060

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Other References for CVE-2022-22060 (1)

Same Patch Batch · Qualcomm, Inc. · 2023-06-06 · 32 CVEs total

CVE-2023-21628 8.4 HIGH Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN HAL
CVE-2022-40507 8.4 HIGH Double free in Core
CVE-2022-40522 8.4 HIGH Double free in Linux Networking
CVE-2022-33307 8.4 HIGH Double free in Automotive
CVE-2023-21632 8.4 HIGH Stack-based Buffer Overflow in Automotive GPU
CVE-2023-21669 8.2 HIGH Buffer Over-read in WLAN HOST
CVE-2022-33264 7.9 HIGH Stack-based buffer overflow in Modem
CVE-2023-21657 7.8 HIGH Improper Input Validation in Audio
CVE-2023-21656 7.8 HIGH Improper Input Validation in WLAN HOST
CVE-2023-21670 7.8 HIGH Improper Access control in GPU Subsystem
CVE-2023-21658 7.5 HIGH Buffer Over-Read in WLAN Firmware
CVE-2023-21659 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2022-40538 7.5 HIGH Reachable assertion in Modem
CVE-2022-40536 7.5 HIGH Improper authentication in Modem
CVE-2022-33251 7.5 HIGH Reachable assertion in Modem
CVE-2023-21660 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2023-21661 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2022-40521 7.5 HIGH Improper authorization in Modem
CVE-2022-22076 7.1 HIGH Cryptographic issue in Core
CVE-2022-40523 7.1 HIGH Information exposure in Kernel

Showing top 20 of 32 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-617

V. Comments for CVE-2022-22060

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