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I. Basic Information for CVE-2022-22819
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
NXP LPC55S66JBD64, LPC55S66JBD100, LPC55S66JEV98, LPC55S69JBD64, LPC55S69JBD100, and LPC55S69JEV98 microcontrollers (ROM version 1B) have a buffer overflow in parsing SB2 updates before the signature is verified. This can allow an attacker to achieve non-persistent code execution via a crafted unsigned update.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Nxp Semiconductors Nxp Lpc55S69 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Nxp Semiconductors Nxp Lpc55S69是荷兰恩智浦半导体(Nxp Semiconductors)公司的一块开发板。用于添加用于网络、传感器、显示器和其他接口的现成附加板。 Nxp Semiconductors Nxp Lpc55S69 存在安全漏洞,该漏洞源于在验证签名前解析SB2更新存在缓冲区溢出。攻击者利用该漏洞通过特制的无符号更新实现非持久性代码执行。以下产品和版本受到影响:NXP LPC55S66JBD64、LPC55S66JBD100、LPC55S66JEV98、LPC5
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
-n/a n/a -
II. Public POCs for CVE-2022-22819
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III. Intelligence Information for CVE-2022-22819
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IV. Related Vulnerabilities
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