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CVE-2022-33292— Use after free in Qualcomm IPC

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm IPC是美国高通（Qualcomm）公司的一个用于芯片中的支撑组件。 Qualcomm IPC存在安全漏洞，该漏洞源于存在内存损坏。

CVSS 7.8 · High EPSS 0.12% · P2

Possible ATT&CK Techniques 1 AI

T1203 · Exploitation for Client Execution
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I. Basic Information for CVE-2022-33292

Vulnerability Information
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Vulnerability Title
Use after free in Qualcomm IPC
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
释放后使用
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm IPC 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm IPC是美国高通（Qualcomm）公司的一个用于芯片中的支撑组件。 Qualcomm IPC存在安全漏洞，该漏洞源于存在内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon SG4150P -

II. Public POCs for CVE-2022-33292

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III. Intelligence Information for CVE-2022-33292

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Other References for CVE-2022-33292 (1)

Same Patch Batch · Qualcomm, Inc. · 2023-05-02 · 13 CVEs total

CVE-2023-21666 8.4 HIGH Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics
CVE-2023-21665 8.4 HIGH Incorrect Type Conversion or Cast in Graphics
CVE-2023-21642 8.4 HIGH Improper Access Control in HAB Memory Management
CVE-2022-40505 8.2 HIGH Buffer over-read in Modem
CVE-2022-25713 7.8 HIGH Improper Restriction of Operations within the Bounds of a Memory Buffer in Automotive
CVE-2022-40504 7.5 HIGH Reachable assertion in Modem
CVE-2022-40508 7.5 HIGH Reachable assertion in Modem
CVE-2022-34144 7.5 HIGH Reachable assertion in Modem
CVE-2022-33305 7.5 HIGH Null pointer dereference in Modem
CVE-2022-33304 7.5 HIGH NULL pointers dereference in Modem
CVE-2022-33273 7.3 HIGH Buffer over-read in Trusted Execution Environment
CVE-2022-33281 6.7 MEDIUM Improper validation of array index in computer vision.

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-416

V. Comments for CVE-2022-33292

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