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CVE-2022-40510— Buffer copy without checking size of input in Audio.

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm 芯片存在安全漏洞，该漏洞源于使用 EVS 声码器进行语音通话时，由于缓冲区复制而未检查音频输入大小，导致内存损坏。

CVSS 9.8 · Critical EPSS 0.43% · P35

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2022-40510

Vulnerability Information
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Vulnerability Title
Buffer copy without checking size of input in Audio.
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
使用未经初始化的变量
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm 芯片存在安全漏洞，该漏洞源于使用 EVS 声码器进行语音通话时，由于缓冲区复制而未检查音频输入大小，导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon APQ8009 -

II. Public POCs for CVE-2022-40510

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III. Intelligence Information for CVE-2022-40510

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Same Patch Batch · Qualcomm, Inc. · 2023-08-08 · 18 CVEs total

CVE-2023-28561 9.8 CRITICAL Buffer Copy Without Checking Size of Input in QESL
CVE-2023-21651 9.3 CRITICAL Incorrect Type Conversion or Cast in Core
CVE-2023-21643 9.1 CRITICAL Untrusted Pointer Dereference in Automotive
CVE-2023-22666 8.4 HIGH Integer Overflow or Wraparound in Audio
CVE-2023-28537 8.4 HIGH Integer Overflow or Wraparound in Audio
CVE-2023-21625 8.2 HIGH Buffer Over-read in Network Services
CVE-2023-21652 7.7 HIGH Key Management Errors in HLOS
CVE-2023-28555 7.5 HIGH Buffer Over-read in Audio
CVE-2023-21626 7.1 HIGH Improper Authentication in HLOS.
CVE-2023-28575 6.7 MEDIUM Multiple Type Confusion Vulnerability
CVE-2023-21650 6.7 MEDIUM Improper Validation of Array Index in GPS HLOS Driver
CVE-2023-21649 6.7 MEDIUM Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN
CVE-2023-21648 6.7 MEDIUM Integer Overflow to Buffer Overflow in RIL
CVE-2023-21627 6.7 MEDIUM Incorrect Type Conversion or Cast in Trusted Execution Environment
CVE-2023-28577 6.7 MEDIUM Multiple Dmabuf Kernel Address UAF Vulnerability
CVE-2023-21647 6.5 MEDIUM Improper Input Validation in Bluetooth HOST
CVE-2023-28576 6.4 MEDIUM Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-457

V. Comments for CVE-2022-40510

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