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CVE-2023-21642— Improper Access Control in HAB Memory Management

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 部分Qualcomm产品存在安全漏洞，该漏洞源于HAB内存管理中的访问控制不当，从而导致内存损坏。以下产品受到影响：QAM8295P, QCA6574AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SA8540P, SA9000

CVSS 8.4 · High EPSS 0.10% · P1

Possible ATT&CK Techniques 1 AI

T1203 · Exploitation for Client Execution
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I. Basic Information for CVE-2023-21642

Vulnerability Information
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Vulnerability Title
Improper Access Control in HAB Memory Management
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption in HAB Memory management due to broad system privileges via physical address.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
访问控制不恰当
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 部分Qualcomm产品存在安全漏洞，该漏洞源于HAB内存管理中的访问控制不当，从而导致内存损坏。以下产品受到影响：QAM8295P, QCA6574AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SA8540P, SA9000
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon QAM8295P -

II. Public POCs for CVE-2023-21642

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III. Intelligence Information for CVE-2023-21642

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Other References for CVE-2023-21642 (1)

Same Patch Batch · Qualcomm, Inc. · 2023-05-02 · 13 CVEs total

CVE-2023-21666 8.4 HIGH Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics
CVE-2023-21665 8.4 HIGH Incorrect Type Conversion or Cast in Graphics
CVE-2022-40505 8.2 HIGH Buffer over-read in Modem
CVE-2022-33292 7.8 HIGH Use after free in Qualcomm IPC
CVE-2022-25713 7.8 HIGH Improper Restriction of Operations within the Bounds of a Memory Buffer in Automotive
CVE-2022-40504 7.5 HIGH Reachable assertion in Modem
CVE-2022-40508 7.5 HIGH Reachable assertion in Modem
CVE-2022-34144 7.5 HIGH Reachable assertion in Modem
CVE-2022-33305 7.5 HIGH Null pointer dereference in Modem
CVE-2022-33304 7.5 HIGH NULL pointers dereference in Modem
CVE-2022-33273 7.3 HIGH Buffer over-read in Trusted Execution Environment
CVE-2022-33281 6.7 MEDIUM Improper validation of array index in computer vision.

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-284

V. Comments for CVE-2023-21642

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