Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞,该漏洞源于当injectFdclData接收到无效数据长度的数据时,GPS HLOS驱动程序中的内存损坏。
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| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | AQT1000 | - |
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| # | POC Description | Source Link | Shenlong Link |
|---|
No public POC found.
Login to generate AI POC| CVE-2022-40510 | 9.8 CRITICAL | Buffer copy without checking size of input in Audio. |
| CVE-2023-28561 | 9.8 CRITICAL | Buffer Copy Without Checking Size of Input in QESL |
| CVE-2023-21651 | 9.3 CRITICAL | Incorrect Type Conversion or Cast in Core |
| CVE-2023-21643 | 9.1 CRITICAL | Untrusted Pointer Dereference in Automotive |
| CVE-2023-28537 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-22666 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-21625 | 8.2 HIGH | Buffer Over-read in Network Services |
| CVE-2023-21652 | 7.7 HIGH | Key Management Errors in HLOS |
| CVE-2023-28555 | 7.5 HIGH | Buffer Over-read in Audio |
| CVE-2023-21626 | 7.1 HIGH | Improper Authentication in HLOS. |
| CVE-2023-28575 | 6.7 MEDIUM | Multiple Type Confusion Vulnerability |
| CVE-2023-28577 | 6.7 MEDIUM | Multiple Dmabuf Kernel Address UAF Vulnerability |
| CVE-2023-21649 | 6.7 MEDIUM | Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN |
| CVE-2023-21648 | 6.7 MEDIUM | Integer Overflow to Buffer Overflow in RIL |
| CVE-2023-21627 | 6.7 MEDIUM | Incorrect Type Conversion or Cast in Trusted Execution Environment |
| CVE-2023-21647 | 6.5 MEDIUM | Improper Input Validation in Bluetooth HOST |
| CVE-2023-28576 | 6.4 MEDIUM | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver |