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CVE-2023-21652— Key Management Errors in HLOS

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于HLOS 中的加密问题是因为用于加密/解密信息的派生密钥在使用后出现在堆栈上。

CVSS 7.7 · High EPSS 0.10% · P1

Possible ATT&CK Techniques 1 AI

T1005 · Data from Local System
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I. Basic Information for CVE-2023-21652

Vulnerability Information
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Vulnerability Title
Key Management Errors in HLOS
Source: CVE Program / CVE List V5
Vulnerability Description
Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
密钥管理错误
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片 信任管理问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于HLOS 中的加密问题是因为用于加密/解密信息的派生密钥在使用后出现在堆栈上。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon AQT1000 -

II. Public POCs for CVE-2023-21652

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III. Intelligence Information for CVE-2023-21652

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Same Patch Batch · Qualcomm, Inc. · 2023-08-08 · 18 CVEs total

CVE-2022-40510 9.8 CRITICAL Buffer copy without checking size of input in Audio.
CVE-2023-28561 9.8 CRITICAL Buffer Copy Without Checking Size of Input in QESL
CVE-2023-21651 9.3 CRITICAL Incorrect Type Conversion or Cast in Core
CVE-2023-21643 9.1 CRITICAL Untrusted Pointer Dereference in Automotive
CVE-2023-28537 8.4 HIGH Integer Overflow or Wraparound in Audio
CVE-2023-22666 8.4 HIGH Integer Overflow or Wraparound in Audio
CVE-2023-21625 8.2 HIGH Buffer Over-read in Network Services
CVE-2023-28555 7.5 HIGH Buffer Over-read in Audio
CVE-2023-21626 7.1 HIGH Improper Authentication in HLOS.
CVE-2023-21650 6.7 MEDIUM Improper Validation of Array Index in GPS HLOS Driver
CVE-2023-21627 6.7 MEDIUM Incorrect Type Conversion or Cast in Trusted Execution Environment
CVE-2023-21648 6.7 MEDIUM Integer Overflow to Buffer Overflow in RIL
CVE-2023-21649 6.7 MEDIUM Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN
CVE-2023-28577 6.7 MEDIUM Multiple Dmabuf Kernel Address UAF Vulnerability
CVE-2023-28575 6.7 MEDIUM Multiple Type Confusion Vulnerability
CVE-2023-21647 6.5 MEDIUM Improper Input Validation in Bluetooth HOST
CVE-2023-28576 6.4 MEDIUM Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-320

V. Comments for CVE-2023-21652

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