Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 部分Qualcomm产品存在安全漏洞,该漏洞源于图形中的类型转换不正确。以下产品受到影响:315 5G IoT Modem, 9206 LTE Modem, APQ8017, APQ8052, APQ8056, APQ8064AU, APQ8076, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CS
Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | 315 5G IoT Modem | - |
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| # | POC Description | Source Link | Shenlong Link |
|---|
No public POC found.
Login to generate AI POC| CVE-2023-21666 | 8.4 HIGH | Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics |
| CVE-2023-21642 | 8.4 HIGH | Improper Access Control in HAB Memory Management |
| CVE-2022-40505 | 8.2 HIGH | Buffer over-read in Modem |
| CVE-2022-33292 | 7.8 HIGH | Use after free in Qualcomm IPC |
| CVE-2022-25713 | 7.8 HIGH | Improper Restriction of Operations within the Bounds of a Memory Buffer in Automotive |
| CVE-2022-40504 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-40508 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-34144 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-33305 | 7.5 HIGH | Null pointer dereference in Modem |
| CVE-2022-33304 | 7.5 HIGH | NULL pointers dereference in Modem |
| CVE-2022-33273 | 7.3 HIGH | Buffer over-read in Trusted Execution Environment |
| CVE-2022-33281 | 6.7 MEDIUM | Improper validation of array index in computer vision. |
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