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CVE-2023-21671— Improper Input Validation in Core

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于 Sectools Fuse 比较功能的系统调用期间核心内存损坏。

CVSS 9.3 · Critical EPSS 0.14% · P4

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2023-21671

Vulnerability Information
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Vulnerability Title
Improper Input Validation in Core
Source: CVE Program / CVE List V5
Vulnerability Description
Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
输入验证不恰当
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于 Sectools Fuse 比较功能的系统调用期间核心内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

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Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon FastConnect 6700 -

II. Public POCs for CVE-2023-21671

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III. Intelligence Information for CVE-2023-21671

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Other References for CVE-2023-21671 (1)

Same Patch Batch · Qualcomm, Inc. · 2023-11-07 · 23 CVEs total

CVE-2023-22388 9.8 CRITICAL Use of Out-of-range Pointer Offset in Multi-mode Call Processor
CVE-2023-33045 9.8 CRITICAL Buffer Copy Without Checking Size of Input in WLAN Firmware
CVE-2023-28574 9.0 CRITICAL Improper Input Validation in Core
CVE-2023-24852 8.4 HIGH Improper Authentication in Core
CVE-2023-33074 8.4 HIGH Use After Free in Audio
CVE-2023-28545 8.2 HIGH Improper Restriction of Operations within the Bounds of a Memory Buffer in TZ Secure OS
CVE-2023-33031 7.8 HIGH Buffer Copy Without Checking Size of Input in Automotive Audio
CVE-2023-33059 7.8 HIGH Buffer Copy Without Checking Size of Input in Audio
CVE-2023-33055 7.8 HIGH Buffer Copy Without Checking Size of Input in Audio
CVE-2023-33047 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2023-33048 7.5 HIGH Buffer over-read in WLAN Firmware
CVE-2023-33056 7.5 HIGH NULL Pointer dereference in WLAN Firmware
CVE-2023-33061 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2023-28556 7.1 HIGH Improper Authorization in HLOS
CVE-2023-28570 6.7 MEDIUM Buffer Copy without Checking Size of Input in Audio
CVE-2023-28572 6.6 MEDIUM Buffer Over-read in WLAN HOST
CVE-2023-28569 6.1 MEDIUM Buffer Over-read in WLAN HAL
CVE-2023-28554 6.1 MEDIUM Buffer Over-read in Qualcomm IPC
CVE-2023-28553 6.1 MEDIUM Buffer Over-read in WLAN Host
CVE-2023-28568 6.1 MEDIUM Buffer Over-read in WLAN HAL

Showing top 20 of 23 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-20