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CVE-2023-26073

Quick assessment

Affected
n/a n/a
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

SAMSUNG Mobile Chipset是韩国三星(SAMSUNG)公司的一系列芯片。 SAMSUNG Mobile Chipset 和 Baseband Modem Chipset 的 Exynos 850、Exynos 980、Exynos 1080、Exynos 1280、Exynos 2200、Exynos Modem 5123、Exynos Modem 5300、Exynos Auto T5123、Exynos W920存在缓冲区错误漏洞,该漏洞源于在解码扩展紧急号码列表时参数验证不充分,从

CVSS 7.6 · High EPSS 1.11% · P64

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2023-26073

Vulnerability Information

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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
An issue was discovered in Samsung Mobile Chipset and Baseband Modem Chipset for Exynos 850, Exynos 980, Exynos 1080, Exynos 1280, Exynos 2200, Exynos Modem 5123, Exynos Modem 5300, and Exynos Auto T5123. A heap-based buffer overflow in the 5G MM message codec can occur due to insufficient parameter validation when decoding the extended emergency number list.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:L/UI:N/S:U/C:L/I:L/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
SAMSUNG Mobile Chipset 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
SAMSUNG Mobile Chipset是韩国三星(SAMSUNG)公司的一系列芯片。 SAMSUNG Mobile Chipset 和 Baseband Modem Chipset 的 Exynos 850、Exynos 980、Exynos 1080、Exynos 1280、Exynos 2200、Exynos Modem 5123、Exynos Modem 5300、Exynos Auto T5123、Exynos W920存在缓冲区错误漏洞,该漏洞源于在解码扩展紧急号码列表时参数验证不充分,从
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
- n/a n/a -

II. Public POCs for CVE-2023-26073

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III. Intelligence Information for CVE-2023-26073

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Other References for CVE-2023-26073 (3)

Same Patch Batch · n/a · 2023-03-13 · 23 CVEs total

CVE-2023-26072 7.6 HIGH SAMSUNG Mobile Chipset 缓冲区错误漏洞
CVE-2023-26074 7.6 HIGH SAMSUNG Mobile Chipset 缓冲区错误漏洞
CVE-2023-26076 7.6 HIGH SAMSUNG Mobile Chipset 安全漏洞
CVE-2023-24033 7.5 HIGH SAMSUNG Mobile Chipset 安全漏洞
CVE-2023-1368 7.3 HIGH XHCMS POST Parameter login.php sql injection
CVE-2023-28154 Webpack 安全漏洞
CVE-2023-27093 My-Blog 跨站脚本漏洞
CVE-2023-27065 Tenda W15E 安全漏洞
CVE-2023-27064 Tenda W15E 安全漏洞
CVE-2023-27063 Tenda W15E 安全漏洞
CVE-2023-27062 Tenda W15E 安全漏洞
CVE-2023-27061 Tenda W15E 安全漏洞
CVE-2023-27052 Moosikay E-Commerce System SQL注入漏洞
CVE-2023-27010 Wondershare Dr.Fone 安全漏洞
CVE-2023-25283 D-Link DIR820LA1 缓冲区错误漏洞
CVE-2023-25279 D-Link DIR820LA1 操作系统命令注入漏洞
CVE-2023-25207 PrestaShop SQL注入漏洞
CVE-2023-24762 D-Link DIR-867 操作系统命令注入漏洞
CVE-2023-24579 McAfee Total Protection 安全漏洞
CVE-2023-24578 McAfee Total Protection 代码问题漏洞

Showing top 20 of 23 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

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