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CVE-2023-33111— Improper Validation of Array Index in Audio

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于当 ADSP 设置的 VI 校准状态大于 AFE 校准命令的响应负载中发生 MAX_FBSP_STATE 时，信息泄露。

CVSS 5.5 · Medium EPSS 0.11% · P1

Possible ATT&CK Techniques 1 AI

T1498 · Network Denial of Service
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I. Basic Information for CVE-2023-33111

Vulnerability Information
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Vulnerability Title
Improper Validation of Array Index in Audio
Source: CVE Program / CVE List V5
Vulnerability Description
Information disclosure when VI calibration state set by ADSP is greater than MAX_FBSP_STATE in the response payload to AFE calibration command.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
对数组索引的验证不恰当
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于当 ADSP 设置的 VI 校准状态大于 AFE 校准命令的响应负载中发生 MAX_FBSP_STATE 时，信息泄露。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon AR8035 -

II. Public POCs for CVE-2023-33111

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III. Intelligence Information for CVE-2023-33111

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Other References for CVE-2023-33111 (1)

Same Patch Batch · Qualcomm, Inc. · 2024-04-01 · 16 CVEs total

CVE-2024-21473 9.8 CRITICAL Improper Input Validation in WIN SON
CVE-2024-21472 8.4 HIGH Use After Free in Kernel
CVE-2024-21470 8.4 HIGH Integer Overflow to Buffer Overflow in Graphics Windows
CVE-2024-21468 8.4 HIGH Use After Free in Kernel
CVE-2023-33023 8.4 HIGH Buffer Copy without Checking Size of Input (`Classic Buffer Overflow`) in SPS-Applications
CVE-2023-28547 8.4 HIGH Buffer Copy Without Checking Size of Input in SPS Applications
CVE-2023-33115 7.8 HIGH Buffer Over-read in Trusted Execution Environment
CVE-2024-21454 7.5 HIGH Integer Overflow to Buffer Overflow in Automotive Telematics
CVE-2024-21453 7.5 HIGH Improper Input Validation in Automotive Telematics
CVE-2023-33101 7.5 HIGH Incorrect Type Conversion or Cast in Multi-Mode Call Processor
CVE-2023-33100 7.5 HIGH Improper input validation in Multi-Mode Call Processor
CVE-2023-33099 7.5 HIGH Improper Input Validation in Multi-Mode Call Processor
CVE-2024-21463 7.3 HIGH Buffer Copy Without Checking Size of Input in Audio
CVE-2024-21452 7.3 HIGH Improper Input Validation in Automotive Telematics
CVE-2023-43515 6.6 MEDIUM Buffer copy without checking size of input (Classic buffer overflow) in HLOS

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-129

V. Comments for CVE-2023-33111

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