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CVE-2024-21460— Use of Insufficiently Random Values in Core

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞。攻击者利用该漏洞可以获取敏感信息。

CVSS 7.1 · High EPSS 0.10% · P1

Possible ATT&CK Techniques 1 AI

T1083 · File and Directory Discovery
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I. Basic Information for CVE-2024-21460

Vulnerability Information
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Vulnerability Title
Use of Insufficiently Random Values in Core
Source: CVE Program / CVE List V5
Vulnerability Description
Information disclosure when ASLR relocates the IMEM and Secure DDR portions as one chunk in virtual address space.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:N/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
使用不充分的随机数
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞。攻击者利用该漏洞可以获取敏感信息。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon FastConnect 6900 -

II. Public POCs for CVE-2024-21460

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III. Intelligence Information for CVE-2024-21460

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Other References for CVE-2024-21460 (1)

Same Patch Batch · Qualcomm, Inc. · 2024-07-01 · 15 CVEs total

CVE-2023-43554 8.4 HIGH Improper Restriction of Operations withing the Bounds of a Memory Buffer in DSP Services
CVE-2024-21461 8.4 HIGH Double Free in HLOS
CVE-2024-23372 8.4 HIGH Integer Overflow or Wraparound in Graphics
CVE-2024-23373 8.4 HIGH Use After Free in Graphics
CVE-2024-23380 8.4 HIGH Use After Free in Graphics
CVE-2024-21465 7.8 HIGH Buffer Over-read in Trusted Execution Environment
CVE-2024-23368 7.8 HIGH Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in Qualcomm IPC
CVE-2024-21469 7.3 HIGH Permissions, Privileges, and Access Control issues in TZ Secure OS
CVE-2024-21462 7.1 HIGH Buffer Over-read in TZ Secure OS
CVE-2024-21482 6.8 MEDIUM Improper Restriction of Operations within the Bounds of a Memory Buffer in Linux Boot Load
CVE-2024-21456 6.5 MEDIUM Buffer Over-read in WLAN HOST
CVE-2024-21457 6.5 MEDIUM Buffer Over-read in WLAN Host Communication
CVE-2024-21458 6.5 MEDIUM Buffer Over-read in WLAN HOST
CVE-2024-21466 6.5 MEDIUM Integer Underflow (Wrap or Wraparound) in WLAN Host Communication

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-330

V. Comments for CVE-2024-21460

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