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CVE-2025-47324— Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于通过电力线访问和修改远程设备PIB文件可能导致信息泄露。

CVSS 7.5 · High EPSS 0.19% · P8

Possible ATT&CK Techniques 1 AI

T1530 · Data from Cloud Storage
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I. Basic Information for CVE-2025-47324

Vulnerability Information
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Vulnerability Title
Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware
Source: CVE Program / CVE List V5
Vulnerability Description
Information disclosure while accessing and modifying the PIB file of a remote device via powerline.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
CWE-1230
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于通过电力线访问和修改远程设备PIB文件可能导致信息泄露。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon QCA7005 -

II. Public POCs for CVE-2025-47324

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III. Intelligence Information for CVE-2025-47324

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Same Patch Batch · Qualcomm, Inc. · 2025-08-06 · 24 CVEs total

CVE-2025-27075 7.8 HIGH Improper Validation of Array Index in Bluetooth HOST
CVE-2025-27076 7.8 HIGH Time-of-check Time-of-use (TOCTOU) Race Condition in Display
CVE-2025-21455 7.8 HIGH Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux
CVE-2025-21456 7.8 HIGH Use After Free in NPU
CVE-2025-27069 7.8 HIGH Untrusted Pointer Dereference in DSP Service
CVE-2025-27068 7.8 HIGH Buffer Over-read in Camera
CVE-2025-27067 7.8 HIGH Improper Validation of Array Index in DSP Service
CVE-2025-21458 7.8 HIGH Use After Free in NPU
CVE-2025-21461 7.8 HIGH Out-of-bounds Write in Camera_Linux
CVE-2025-27062 7.8 HIGH Improper Access Control in Automotive Multimedia
CVE-2025-21473 7.8 HIGH Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux
CVE-2025-21474 7.8 HIGH Use After Free in BTHOST
CVE-2025-21452 7.5 HIGH Reachable Assertion in Modem
CVE-2025-21477 7.5 HIGH Improper Input Validation in Modem
CVE-2025-27065 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2025-27066 7.5 HIGH Reachable Assertion in WLAN Firmware
CVE-2025-27073 7.5 HIGH Reachable Assertion in WLAN Firmware
CVE-2025-27071 7.3 HIGH Buffer Copy Without Checking Size of Input in Powerline Communication Firmware
CVE-2025-21465 6.5 MEDIUM Out-of-bounds Read in Core
CVE-2025-21464 6.5 MEDIUM Out-of-bounds Read in Core

Showing top 20 of 24 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-1230

V. Comments for CVE-2025-47324

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