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CVE-2025-47381— Use After Free in Automotive Audio

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在资源管理错误漏洞，该漏洞源于处理IOCTL调用时，对共享缓冲区的并发访问可能导致内存损坏。

CVSS 7.8 · High EPSS 0.07% · P0

Possible ATT&CK Techniques 1 AI

T1203 · Exploitation for Client Execution
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I. Basic Information for CVE-2025-47381

Vulnerability Information
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Vulnerability Title
Use After Free in Automotive Audio
Source: CVE Program / CVE List V5
Vulnerability Description
Memory Corruption while processing IOCTL calls when concurrent access to shared buffer occurs.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
释放后使用
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在资源管理错误漏洞，该漏洞源于处理IOCTL调用时，对共享缓冲区的并发访问可能导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon LeMans_AU_LGIT -

II. Public POCs for CVE-2025-47381

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III. Intelligence Information for CVE-2025-47381

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Vendor Advisories for CVE-2025-47381 (1)

Same Patch Batch · Qualcomm, Inc. · 2026-03-02 · 15 CVEs total

CVE-2026-21385 7.8 HIGH Integer Overflow or Wraparound in Graphics
CVE-2025-59603 7.8 HIGH Out-of-bounds Write in Computer Vision
CVE-2025-59600 7.8 HIGH Buffer Over-read in Graphics
CVE-2025-47386 7.8 HIGH Use After Free in Automotive Audio
CVE-2025-47385 7.8 HIGH Improper Access Control for Register Interface in SCE-Mink
CVE-2025-47379 7.8 HIGH Use After Free in Automotive Audio
CVE-2025-47377 7.8 HIGH Use After Free in Automotive Audio
CVE-2025-47376 7.8 HIGH Use After Free in Automotive Audio
CVE-2025-47375 7.8 HIGH Use After Free in Automotive Audio
CVE-2025-47373 7.8 HIGH Out-of-bounds Write in Automotive
CVE-2025-47383 7.2 HIGH Missing Cryptographic Step in Data Modem
CVE-2025-47378 7.1 HIGH Exposure of Sensitive System Information to an Unauthorized Control Sphere in HLOS
CVE-2025-47384 6.5 MEDIUM Reachable Assertion in FW
CVE-2025-47371 6.5 MEDIUM Reachable Assertion in Modem

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-416

V. Comments for CVE-2025-47381

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