CVE-2026-21370— Out-of-bounds Write in Camera Driver
Possible ATT&CK Techniques 1AI
T1190 · Exploit Public-Facing ApplicationAffected Version Matrix 91
| Vendor | Product | Version Range | Status |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6700 | affected |
FastConnect 6900 | affected | ||
FastConnect 7800 | affected | ||
G3x Gen 2 | affected | ||
IQ9 Series Platform | affected | ||
LeMans_AU_LGIT | affected | ||
LeMansAU | affected | ||
Netrani | affected | ||
| … +83 more rows | |||
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I. Basic Information for CVE-2026-21370
Vulnerability Information
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Vulnerability Title
Out-of-bounds Write in Camera Driver
Source: CVE Program / CVE List V5
Vulnerability Description
Memory Corruption when validating input batch size and buffer plane count exceeds maximum allowed values.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:H/PR:L/UI:N/S:C/C:L/I:L/A:L
Source: CVE Program / CVE List V5
Vulnerability Type
跨界内存写
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国Qualcomm公司的一系列芯片组。 Qualcomm Chipsets存在缓冲区错误漏洞，该漏洞源于在验证输入批量大小和缓冲平面数时内存损坏，可能导致内存损坏。以下版本受到影响：FastConnect 6700版本、FastConnect 6900版本、FastConnect 7800版本、G3x Gen 2版本、IQ9 Series Platform版本、LeMans_AU_LGIT版本、LeMansAU版本、Netrani版本、Pandeiro版本、QAM82
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6700 | - |
II. Public POCs for CVE-2026-21370
| # | POC Description | Source Link | Shenlong Link |
|---|
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Vendor Advisories for CVE-2026-21370 (1)
Same Patch Batch · Qualcomm, Inc. · 2026-07-06 · 11 CVEs total
| CVE-2026-25268 | 8.8 HIGH | Stack-based Buffer Overflow in WLAN Host |
| CVE-2026-25271 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service |
| CVE-2026-21379 | 7.8 HIGH | Buffer Over-read in Windows Compute |
| CVE-2026-21383 | 7.1 HIGH | Reusing a Nonce, Key Pair in Encryption in HLOS |
| CVE-2025-59617 | 6.6 MEDIUM | Use After Free in Computer Vision |
| CVE-2025-59616 | 6.6 MEDIUM | Use After Free in Computer Vision |
| CVE-2025-59615 | 6.6 MEDIUM | Use After Free in Computer Vision |
| CVE-2026-21384 | 5.3 MEDIUM | Out-of-bounds Write in Camera Driver |
| CVE-2026-21369 | 5.3 MEDIUM | Out-of-bounds Write in Camera Driver |
| CVE-2026-21368 | 5.3 MEDIUM | Out-of-bounds Write in Camera Driver |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2026-21370
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