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I. Basic Information for CVE-2026-21372
Vulnerability Information
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Vulnerability Title
Heap-Based Buffer Overflow in Power Management IC
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
堆缓冲区溢出
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于在memcpy操作期间发送具有无效缓冲区大小的IOCTL请求，可能导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Cologne -
II. Public POCs for CVE-2026-21372
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III. Intelligence Information for CVE-2026-21372
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-122
V. Comments for CVE-2026-21372

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