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CVE-2026-25277— Buffer Copy Without Checking Size of Input in Secure Processor

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
Public or AI PoC available; prioritize validation
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于使用Strongbox时存在缓冲区溢出。

CVSS 8.8 · High EPSS 0.07% · P0

Affected Version Matrix 5

VendorProduct Version RangeStatus
Qualcomm, Inc. Snapdragon Snapdragon 8 Gen 2 Mobile Platform affected
Snapdragon 8+ Gen 2 Mobile Platform affected
Snapdragon 8 Gen 3 Mobile Platform affected
Snapdragon 8 Elite affected
Snapdragon 8 Elite Gen 5 affected
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I. Basic Information for CVE-2026-25277

Vulnerability Information
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Vulnerability Title
Buffer Copy Without Checking Size of Input in Secure Processor
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption while using Strongbox due to buffer overflow.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:C/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
未进行输入大小检查的缓冲区拷贝(传统缓冲区溢出)
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于使用Strongbox时存在缓冲区溢出。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Snapdragon 8 Gen 2 Mobile Platform -

II. Public POCs for CVE-2026-25277

# POC Description Source Link Shenlong Link
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default-local-qwen3.6 · 12861 chars
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Trigger conditions & impact
Full executable POC code
Exploit chain & mitigation
POC zip download
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III. Intelligence Information for CVE-2026-25277

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Same Patch Batch · Qualcomm, Inc. · 2026-06-01 · 22 CVEs total

CVE-2026-25276 8.8 HIGH Improper Validation of Array Index in Secure Processor
CVE-2026-24088 8.2 HIGH Missing Authentication for Critical Function in Boot
CVE-2025-59604 7.8 HIGH NULL Pointer Dereference in SPS Applications
CVE-2026-25260 7.8 HIGH Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service
CVE-2026-25259 7.8 HIGH Out-of-bounds Write in DSP Service
CVE-2026-25258 7.8 HIGH Out-of-bounds Read in DSP Service
CVE-2025-59606 7.8 HIGH NULL Pointer Dereference in HLOS
CVE-2025-59605 7.8 HIGH Out-of-bounds Write in HLOS
CVE-2026-24085 7.2 HIGH Stack-based Buffer Overflow in Display
CVE-2026-24087 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Kernel
CVE-2026-24089 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Kernel
CVE-2026-24091 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Display
CVE-2026-24092 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Display
CVE-2026-24090 7.1 HIGH Missing Authentication for Critical Function in HLOS
CVE-2025-59611 6.7 MEDIUM Out-of-bounds Write in Core Services
CVE-2025-59612 6.7 MEDIUM Stack-based Buffer Overflow in Windows Compute
CVE-2025-59613 6.7 MEDIUM Stack-based Buffer Overflow in Windows Compute
CVE-2025-59614 6.7 MEDIUM Out-of-bounds Write in Windows Compute
CVE-2025-59601 6.5 MEDIUM Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware
CVE-2025-59610 6.4 MEDIUM Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Driver

Showing top 20 of 22 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-120

V. Comments for CVE-2026-25277

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