Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1336 CNY

100%
Buy Us a Coffee

CVE-2018-11938

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在缓冲区错误漏洞，该漏洞源于网络系统或产品在内存上执行操作时，未正确验证数据边界，导致向关联的其他内存位置上执行了错误的读写操作。攻击者可利用该漏洞导致缓冲区溢出或堆溢出等。以下产品受到影响：Qualcomm IPQ8074；MDM9150；MDM9206；MDM9607；MDM9650；MSM8909W；MSM8996AU；QCA8081；QCS605；SD 210；SD

AI Predicted 7.8 Difficulty: Moderate EPSS 0.25% · P16
Get alerts for future matching vulnerabilities Log in to subscribe

I. Basic Information for CVE-2018-11938

Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Improper input validation for argument received from HLOS can lead to buffer overflows and unexpected behavior in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130.
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在缓冲区错误漏洞，该漏洞源于网络系统或产品在内存上执行操作时，未正确验证数据边界，导致向关联的其他内存位置上执行了错误的读写操作。攻击者可利用该漏洞导致缓冲区溢出或堆溢出等。以下产品受到影响：Qualcomm IPQ8074；MDM9150；MDM9206；MDM9607；MDM9650；MSM8909W；MSM8996AU；QCA8081；QCS605；SD 210；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon W IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD -

II. Public POCs for CVE-2018-11938

# POC Description Source Link Shenlong Link
AI-Generated POC Premium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2018-11938

请登录查看更多情报信息。

Vendor Advisories for CVE-2018-11938 (1)

Other References for CVE-2018-11938 (1)

Same Patch Batch · Qualcomm, Inc. · 2019-02-25 · 17 CVEs total

CVE-2018-11289 多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11820 多款Qualcomm产品加密问题漏洞
CVE-2018-11845 多款Qualcomm产品信息泄露漏洞
CVE-2018-11864 多款Qualcomm产品输入验证漏洞
CVE-2018-11931 多款Qualcomm产品输入验证漏洞
CVE-2018-11932 多款Qualcomm产品输入验证漏洞
CVE-2018-11935 多款Qualcomm产品输入验证漏洞
CVE-2018-11945 多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11948 多款Qualcomm产品安全漏洞
CVE-2018-13900 多款Qualcomm产品安全漏洞
CVE-2018-13904 多款Qualcomm产品输入验证漏洞
CVE-2018-13905 多款Qualcomm产品安全漏洞
CVE-2018-13912 多款Qualcomm产品缓冲区错误漏洞
CVE-2018-13913 多款Qualcomm产品输入验证错误漏洞
CVE-2018-13914 多款Qualcomm产品缓冲区错误漏洞
CVE-2018-5839 多款Qualcomm产品访问控制错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2018-11938

No comments yet

Leave a comment