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I. Basic Information for CVE-2018-13888
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品RIL 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通(Qualcomm)公司应用于不同平台的中央处理器(CPU)产品。 多款Qualcomm产品中的RIL存在缓冲区溢出漏洞。远程攻击者可利用该漏洞造成RIL守护进程中的内存损坏。以下产品受到影响:Qualcomm MDM9206;MDM9607;MDM9635M;MDM9650;MSM8909W;SD 210;SD 212;SD 205;SD 425;SD 427;SD 430;SD 435;SD 439;SD 429;SD 450;SD 625;SD 636;
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ -
II. Public POCs for CVE-2018-13888
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III. Intelligence Information for CVE-2018-13888
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IV. Related Vulnerabilities
V. Comments for CVE-2018-13888

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