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I. Basic Information for CVE-2019-10606
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Out-of-bound access will occur in USB driver due to lack of check to validate the frame size passed by user in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9607, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, QCS605, SDX24
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9607等都是美国高通（Qualcomm）公司的产品。MDM9607是一款中央处理器（CPU）产品。SDX24是一款调制解调器。QCS605是一款中央处理器（CPU）产品。 多款Qualcomm产品中的USB驱动程序存在缓冲区错误漏洞。本地攻击者可通过发送特制请求利用该漏洞执行任意代码。以下产品及版本受到影响：Qualcomm MDM9607；MSM8909W；MSM8917；MSM8920；MSM8937；MSM8940；QCS605；SDX24。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables MDM9607, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, QCS605, SDX24 -
II. Public POCs for CVE-2019-10606
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III. Intelligence Information for CVE-2019-10606
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2019-10606

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