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I. Basic Information for CVE-2018-3583
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
A buffer overflow can occur while processing an extscan hotlist event in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9379, QCS605, SD 625, SD 636, SD 820, SD 820A, SD 835, SD 855, SDA660, SDM630, SDM660, SDX20
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品WLAN 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的产品。MDM9206是一款中央处理器（CPU）产品。MDM9607是一款中央处理器（CPU）产品。MDM9640是一款中央处理器（CPU）产品。WLAN是其中的一个无线局域网组件。 多款Qualcomm产品中的WLAN存在缓冲区溢出漏洞。该漏洞源于网络系统或产品在内存上执行操作时，未正确验证数据边界，导致向关联的其他内存位置上执行了错误的读写操作。攻击者可利用该漏洞导致缓冲区溢出或堆溢出等。以下产品及版本受到影响：Qualcomm M
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCS405, QCS605, SD 636, SD 675, SD 730, SD 820A, SD 835, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24 -
II. Public POCs for CVE-2018-3583
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III. Intelligence Information for CVE-2018-3583
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New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-3583

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