Vulnerability Information
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Vulnerability Title
N/A
Vulnerability Description
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices installs a zero long term key (LTK) if an out-of-order link-layer encryption request is received during Secure Connections pairing. An attacker in radio range can have arbitrary read/write access to protected GATT service data, cause a device crash, or possibly control a device's function by establishing an encrypted session with the zero LTK.
CVSS Information
N/A
Vulnerability Type
N/A
Vulnerability Title
多款Telink Semiconductor产品 安全漏洞
Vulnerability Description
Telink Semiconductor BLE SDK是中国泰凌微（Telink Semiconductor）公司的一款应用程序。 多款Telink Semiconductor产品中的BLE SDK的Bluetooth Low Energy Secure Manager Protocol(SMP)存在安全漏洞。攻击者可利用该漏洞对受保护的GATT服务数据进行任意读/写操作，导致设备崩溃，或可能控制设备的功能。以下产品及版本受到影响：Telink Semiconductor TLSR8258 BLE SD
CVSS Information
N/A
Vulnerability Type
N/A