Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1359 CNY

100%

CVE-2019-19196

Quick assessment

Affected
n/a n/a
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Telink Semiconductor BLE SDK是中国泰凌微(Telink Semiconductor)公司的一款应用程序。 多款Telink Semiconductor产品存在缓冲区错误漏洞。攻击者可借助特制的数据包利用该漏洞造成拒绝服务。以下产品及版本受到影响:Telink Semiconductor TLSR8258 BLE SDK 3.4.0及之前版本;Telink Semiconductor TLSR8269 BLE SDK 3.3及之前版本;Telink Semiconductor T

AI Predicted 7.5 Difficulty: Easy EPSS 1.36% · P71
Get alerts for future matching vulnerabilities Log in to subscribe

I. Basic Information for CVE-2019-19196

Vulnerability Information

Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Telink Semiconductor产品 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Telink Semiconductor BLE SDK是中国泰凌微(Telink Semiconductor)公司的一款应用程序。 多款Telink Semiconductor产品存在缓冲区错误漏洞。攻击者可借助特制的数据包利用该漏洞造成拒绝服务。以下产品及版本受到影响:Telink Semiconductor TLSR8258 BLE SDK 3.4.0及之前版本;Telink Semiconductor TLSR8269 BLE SDK 3.3及之前版本;Telink Semiconductor T
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
- n/a n/a -

II. Public POCs for CVE-2019-19196

# POC Description Source Link Shenlong Link
AI-Generated POC Premium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2019-19196

请登录查看更多情报信息。

Security Blog Posts for CVE-2019-19196 (1)

Other References for CVE-2019-19196 (1)

Same Patch Batch · n/a · 2020-02-12 · 51 CVEs total

CVE-2019-19194 多款Telink Semiconductor产品 安全漏洞
CVE-2014-2560 PhonerLite 信息泄露漏洞
CVE-2014-6262 Zenoss Core RRDtool 格式化字符串错误漏洞
CVE-2014-2595 Barracuda Networks Barracuda Web Application Firewall 代码问题漏洞
CVE-2014-4968 Boat Browser WebView Class 代码注入漏洞
CVE-2014-0234 Red Hat OpenShift Enterprise 安全漏洞
CVE-2019-19921 runc 安全漏洞
CVE-2014-9390 Mercurial输入验证错误漏洞
CVE-2013-7378 Hubot Scripts email.coffee模块注入漏洞
CVE-2020-8595 Istio 授权问题漏洞
CVE-2014-4607 Oberhumer LZO 输入验证错误漏洞
CVE-2013-7381 node-libnotify 注入漏洞
CVE-2015-5617 Enorth Webpublisher CMS SQL注入漏洞
CVE-2020-8815 IKTeam BearFTP 输入验证错误漏洞
CVE-2020-8839 CHIYU BF-430 232/485 TCP/IP Converter 跨站脚本漏洞
CVE-2015-7890 Samsung S6 Edge Exynos Seiren Audio 缓冲区错误漏洞
CVE-2013-1410 Perforce P4web 跨站脚本漏洞
CVE-2013-4090 Varnish HTTP cache 安全漏洞
CVE-2013-3685 Sprite Software Spritebud和Backup 竞争条件问题漏洞
CVE-2013-6236 IZON IP 信任管理问题漏洞

Showing top 20 of 51 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

V. Comments for CVE-2019-19196

No comments yet


Leave a comment